Today, troops around the world can leverage troves of data at their fingertips, including at the tactical edge. That access marks an important step forward for warfighter technology, but to maximize decision-making at speed, these data volumes require granular, high-speed processing at their points of collection.
High-performance computing relies heavily on internal microelectronics. Going forward, breakthrough performance will be driven by 3D heterogeneously integrated (3DHI) technologies that stack separately manufactured components, containing different semiconductors and materials, within a single package.